ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,773, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit structure, and m... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,313, issued on Nov. 25, was assigned to TAIGA MOTORS INC. (Lasalle, Canada). "Runaway prevention systems and methods for electric vehicles"... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,995, issued on Nov. 25, was assigned to Mitsubishi Electric Research Laboratories Inc.. "System and method for eccentricity severity estima... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,967, issued on Nov. 25, was assigned to Huabao (Tianjin) New MaterialScience And TechnologyDevelopment Co. Ltd. (Tianjin, China) and Shanxi ... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,442, issued on Nov. 25, was assigned to PURE STORAGE INC. (Santa Clara, Calif.). "Data storage system with managed flash" was invented by R... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,378, issued on Nov. 25, was assigned to Welltec Manufacturing Center Completions ApS (Esbjerg N, Switzerland). "Annular barrier with valve ... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,149, issued on Nov. 25, was assigned to ECOLAB USA INC. (St. Paul, Minn.). "Method for the rapid detection of bacterial spores in an indust... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,323, issued on Nov. 25, was assigned to Aristocrat Technologies Australia Pty Ltd. (North Ryde, Australia). "Electronic gaming machines wit... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,225, issued on Nov. 25, was assigned to SKYWORKS GLOBAL PTE. LTD. (Singapore). "Bulk acoustic wave resonator with oxide raised frame" was i... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,759, issued on Nov. 25, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin, China). "Wafer-level ASIC 3D integrated substrate, pack... Read More