US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Integrated circuit structure, and method for forming thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,773, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit structure, and method for forming thereof" was invented by Yi-Chao Mao (Taoyuan, Taiwan), Chin-Chuan Chang (Hsinchu County, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan), Kun-Tong Tsai (Hsinchu, Taiwan) and Hung-Chih Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure is provided. The integrated circuit structure includes a die that contains a substrate, an interconnection structure, active connectors and dummy connectors. The interconnection structure is disposed over the substrate. The ...