ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,430, issued on Jan. 27, was assigned to Huawei Digital Power Technologies Co. Ltd. (Shenzhen, China). "Energy storage system and black star... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,400, issued on Jan. 27, was assigned to Eaton Intelligent Power Ltd. (Ireland). "Systems and methods for optical particle detection" was in... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,760, issued on Jan. 27, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Packet forwarding method and apparatus, network d... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,298, issued on Jan. 27, was assigned to Beijing Jingdong Zhenshi Information Technology Co. Ltd. (Beijing). "Method and apparatus for outbo... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,006, issued on Jan. 27, was assigned to NEC Corp. (Tokyo). "Endoscopic examination support apparatus, endoscopic examination support method... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,160, issued on Jan. 27, was assigned to PETROLEO BRASILEIRO S.A.-PETROBRAS (Rio de Janeiro, Brazil). "Boiler burner rigid lance" was invent... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,815, issued on Jan. 27, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo). "Management method for mobile object, control method for ... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,825, issued on Jan. 27, was assigned to KWANSEI GAKUIN EDUCATIONAL FOUNDATION (Hyogo, Japan) and TOYOTA TSUSHO Corp. (Nagoya, Japan). "SiC ... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,755, issued on Jan. 27, was assigned to KYOCERA Document Solutions Inc. (Osaka, Japan). "Image forming apparatus" was invented by Tatsuya Y... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,815, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of fabricat... Read More