US Patent Issued to SAMSUNG ELECTRONICS on Jan. 27 for "Semiconductor package and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,815, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Yong Hwan Kwon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided and includes: a base substrate; an interposer package on the base substrate; and first and second semiconductor chips on the interposer package, wherein the interposer package includes: a first redistribution structure including a first insulating layer, a second insulating layer on the first insulating layer, and first and second redistribution layers respectively...