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US Patent Issued to Beijing Youzhuju Network Technology on Dec. 2 for "Wearable electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,503, issued on Dec. 2, was assigned to Beijing Youzhuju Network Technology Co. Ltd. (Beijing). "Wearable electronic device" was invented by ... Read More


US Patent Issued to Micron Technology on Dec. 2 for "Liquid cooling manifold" (Indian Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,407, issued on Dec. 2, was assigned to Micron Technology Inc. (Boise, Idaho). "Liquid cooling manifold" was invented by Suresh Reddy Yarragu... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 2 for "Multigate device having reduced contact resistivity" (Belgian Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,456, issued on Dec. 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Multigate device having reduced conta... Read More


US Patent Issued to ENTEGRIS on Dec. 2 for "Post CMP cleaning composition" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,473, issued on Dec. 2, was assigned to ENTEGRIS INC. (Billerica, Mass.). "Post CMP cleaning composition" was invented by Volley Wang (Zhubei... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Electronic device including flexible printed circuit board and operating method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,374, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Electronic device including flexible printed c... Read More


US Patent Issued to SONY GROUP on Dec. 2 for "Information processing apparatus and information processing method" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,875, issued on Dec. 2, was assigned to SONY GROUP Corp. (Tokyo). "Information processing apparatus and information processing method" was in... Read More


US Patent Issued to SUMCO on Dec. 2 for "Device for polishing outer periphery of wafer" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,513, issued on Dec. 2, was assigned to SUMCO Corp. (Tokyo). "Device for polishing outer periphery of wafer" was invented by Kenji Satomura (... Read More


US Patent Issued to XPAN on Dec. 2 for "Radially expandable cannula devices, and systems and methods for using them" (Canadian Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,484,931, issued on Dec. 2, was assigned to XPAN Inc. (Nobleton, Canada). "Radially expandable cannula devices, and systems and methods for using... Read More


US Patent Issued to Honda Motor, Latd. on Dec. 2 for "Division line recognition apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,330, issued on Dec. 2, was assigned to Honda Motor Co. Latd. (Tokyo). "Division line recognition apparatus" was invented by Shunsuke Konishi... Read More


US Patent Issued to Beijing Bytedance Network Technology on Dec. 2 for "Lamp" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. D1,104,334, issued on Dec. 2, was assigned to Beijing Bytedance Network Technology Co. Ltd. (Beijing). "Lamp" was invented by Weikang Duan (Beijing... Read More