US Patent Issued to SUMCO on Dec. 2 for "Device for polishing outer periphery of wafer" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,513, issued on Dec. 2, was assigned to SUMCO Corp. (Tokyo).

"Device for polishing outer periphery of wafer" was invented by Kenji Satomura (Nagasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing apparatus for an outer peripheral portion of a wafer includes: a stage for horizontally holding a disc-shaped wafer; a rotation drive unit for rotating the stage around its center axis as a rotation axis; polishing heads having an inner circumferential surface mounted with polishing pads; and a polishing-head drive mechanism for bringing the polishing pads into contact with the outer peripheral portion of the wafer and sliding the polishin...