ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,342, issued on Dec. 16. "Method for preparing a working electrode" was invented by Arnfried Guenther (Hirschberg, Germany) and Alexander St... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,240, issued on Dec. 16, was assigned to Tom Lambotte (Beachwood, Ohio). "Apparatus and method for enhancing cybersecurity of an entity" was... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,707, issued on Dec. 16, was assigned to DOWA METALTECH Co. LTD. (Tokyo). "Ag-plated material, method for producing Ag-plated material, and ... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,330, issued on Dec. 16, was assigned to QUALCOMM Inc. (San Diego). "Handover timelines and power optimization for user equipment in multipl... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,193, issued on Dec. 16, was assigned to LG DISPLAY Co. LTD. (Seoul, South Korea). "Apparatus" was invented by Juwon Kim (Gyeonggi-do, South... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,354, issued on Dec. 16, was assigned to University of Southern California (Los Angeles). "Efficient conversion of methane to methanesulfoni... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,868, issued on Dec. 16, was assigned to Kioxia Corp. (Tokyo). "Memory system and control method" was invented by Yuki Sasaki (Kamakura Kana... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,489, issued on Dec. 16, was assigned to THE BOEING COMPANY (Arlington, Va.). "Schiff base oligomers" was invented by Andrew M. Zweig (Akron... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,420, issued on Dec. 16, was assigned to QUALCOMM Inc. (San Diego). "Signaling to override radio resource control (RRC) configured direction... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,157, issued on Dec. 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor package device wi... Read More