US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 16 for "Semiconductor package device with integrated inductor and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,157, issued on Dec. 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package device with integrated inductor and manufacturing method thereof" was invented by Ying-Chih Hsu (Hsinchu, Taiwan) and Wen-Shiang Liao (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device is provided. A permalloy device is received. An interposer die is formed. A conductive coil is formed over a substrate, and the conductive coil includes a bottom metal layer over the substrate, a middle metal layer and a top metal layer interconnected to each other. The per...