US Patent Issued to DOWA METALTECH on Dec. 16 for "Ag-plated material, method for producing Ag-plated material, and electrical component" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,707, issued on Dec. 16, was assigned to DOWA METALTECH Co. LTD. (Tokyo).

"Ag-plated material, method for producing Ag-plated material, and electrical component" was invented by Yosuke Sato (Tokyo), Yutaro Hirai (Tokyo) and Kentaro Arai (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided an Ag-plated material and a related technique, including: an Ag-plated layer on a substrate that comprises a conductive metal; and a plurality of two-layer plating structures on the substrate, the two-layer plating structures having a porous Ni-plated layer and an Ag-plated layer in this order from a substrate side."

The patent was filed on July ...