ALEXANDRIA, Va., June 10 -- United States Patent no. 12,292,194, issued on May 6, was assigned to GENERAL ELECTIC COMPANY (Evendale, Ohio). "Ignitor housing for a combustor of a gas turbine" was inve... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,913, issued on May 6, was assigned to Geotab Inc. (Oakville, Canada). "Redundant asset tracking" was invented by Glenn H. Atkinson (Palgrav... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. D1,073,758, issued on May 6, was assigned to LAM RESEARCH Corp. (Fremont, Calif.). "Baffle for substrate processing system" was invented by Karthi... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,707, issued on May 6, was assigned to ADRC. Co. KR (Seoul, South Korea). "Pixel circuit and display including the same" was invented by Jin... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,291,960, issued on May 6, was assigned to Halliburton Energy Services Inc. (Houston). "Sealing detection during formation pressure testing" was... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,646, issued on May 6. "Monitoring and advanced asset recovery devices and systems" was invented by Brian A. Abbas (Yuma, Ariz.) and Jason A... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. D1,073,913, issued on May 6, was assigned to Tomoegawa Corp. (Tokyo). "Heat exchange plate" was invented by Shuhei Hatano (Shizuoka, Japan) and Ma... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,049, issued on May 6, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Touch display panel, method for manufacturing the same, and... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,095, issued on May 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Storage device and data access method thereof"... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,948, issued on May 6, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Flip chip semiconductor device package with mold compound seal" was... Read More