ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,448, issued on Nov. 18, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Application programming interface to select storage" was inven... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,471,735, issued on Nov. 18, was assigned to LG Electronics Inc. (Seoul, South Korea). "Cooking appliance" was invented by Gyeongdong Kim (Seoul... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,901, issued on Nov. 18, was assigned to GM GLOBAL TECHNOLOGY OPERATIONS LLC (Detroit). "Belt securement verification system" was invented b... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,782, issued on Nov. 18, was assigned to Cisco Technology Inc. (San Jose, Calif.). "Systems and methods for synchronizing network nodes" was... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,474, issued on Nov. 18. "Method and device for producing a suspension" was invented by Ivan Mallinowski (Wassenberg, Germany). According t... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,729, issued on Nov. 18, was assigned to Intel Corp. (Santa Clara, Calif.). "On-chip clock frequency analysis techniques" was invented by Sa... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,637, issued on Nov. 18, was assigned to Apple Inc. (Cupertino, Calif.). "Diffused light rendering of a virtual light source in a 3D environ... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,064, issued on Nov. 18, was assigned to Rigging Projects Ltd (Southhampton, Great Britain). "Automatic locking sail track car systems and a... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,364, issued on Nov. 18, was assigned to Compagnie Generale des Etablissements Michelin (Clermont-Ferrand, France). "Tire sidewall" was inve... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,161, issued on Nov. 18, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor package with lead frame" was invented by Ryuta Kimura ... Read More