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INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "IMAGE SENSOR, IMAGE PROCESSING SYSTEM AND IMAGE SENSOR CONTROL METHOD"

GENEVA, Dec. 1 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#12... Read More


INTERNATIONAL PATENT: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, 国立研究開発法人産業技術総合研究所 FILES APPLICATION FOR "SURFACE POTENTIAL DISTRIBUTION MEASUREMENT DEVICE"

GENEVA, Dec. 1 -- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (3-1, Kasumigaseki 1-chome, Chiyoda-ku, Tokyo1008921), 国立研究開発法&#2015... Read More


INTERNATIONAL PATENT: HITACHI, LTD., 株式会社日立製作所 FILES APPLICATION FOR "ROBOT CONTROL DEVICE, ROBOT CONTROL SYSTEM, ROBOT AND ROBOT CONTROL METHOD"

GENEVA, Dec. 1 -- HITACHI, LTD. (6-6, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008280), 株式会社日立製作所 (東京都千代&... Read More


INTERNATIONAL PATENT: HAMAMATSU PHOTONICS K.K., 浜松ホトニクス株式会社 FILES APPLICATION FOR "TRAINING METHOD, INFERENCE MODEL, NOISE REDUCTION METHOD, NOISE REDUCTION SYSTEM AND NOISE REDUCTION PROGRAM"

GENEVA, Dec. 1 -- HAMAMATSU PHOTONICS K.K. (1126-1, Ichino-cho, Chuo-ku, Hamamatsu-shi, Shizuoka4358558), 浜松ホトニクス株式会社 (&#38... Read More


INTERNATIONAL PATENT: THE UNIVERSITY OF OSAKA, 国立大学法人大阪大学 FILES APPLICATION FOR "HYDROGEL"

GENEVA, Dec. 1 -- THE UNIVERSITY OF OSAKA (1-1, Yamadaoka, Suita-shi, Osaka5650871), 国立大学法人大阪大学 (大阪府吹&... Read More


INTERNATIONAL PATENT: HITACHI, LTD., 株式会社日立製作所 FILES APPLICATION FOR "MATERIAL PROPOSAL SYSTEM AND MATERIAL PROPOSAL DEVICE"

GENEVA, Dec. 1 -- HITACHI, LTD. (6-6, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008280), 株式会社日立製作所 (東京都千代&... Read More


INTERNATIONAL PATENT: MITSUBISHI ELECTRIC CORPORATION, 三菱電機株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND INFORMATION PROCESSING PROGRAM"

GENEVA, Dec. 1 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都&#21315... Read More


INTERNATIONAL PATENT: FICT LIMITED, FICT株式会社 FILES APPLICATION FOR "MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE"

GENEVA, Dec. 1 -- FICT LIMITED (36, Oaza Kitaowaribe, Nagano-shi, Nagano3818501), FICT株式会社 (長野県長野市&#22... Read More


INTERNATIONAL PATENT: HITACHI, LTD., 株式会社日立製作所 FILES APPLICATION FOR "VULNERABILITY ANALYSIS DEVICE AND VULNERABILITY ANALYSIS METHOD"

GENEVA, Dec. 1 -- HITACHI, LTD. (6-6, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008280), 株式会社日立製作所 (東京都千代&... Read More


INTERNATIONAL PATENT: MITSUBISHI ELECTRIC CORPORATION, 三菱電機株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM"

GENEVA, Dec. 1 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都&#21315... Read More