US Patent Issued to HITACHI HIGH-TECH on Feb. 10 for "Liquid delivery pump" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,299, issued on Feb. 10, was assigned to HITACHI HIGH-TECH Corp. (Tokyo). "Liquid delivery pump" was invented by Nobuhiro Tsukada (Tokyo), D... Read More

US Patent Issued to Micron Technology on Feb. 10 for "Corrective read of a memory device with reduced latency" (California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,344, issued on Feb. 10, was assigned to Micron Technology Inc. (Boise, Idaho). "Corrective read of a memory device with reduced latency" wa... Read More

US Patent Issued to Qorvo US on Feb. 10 for "Bandwidth adaptation in a transmission circuit" (French Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,138, issued on Feb. 10, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Bandwidth adaptation in a transmission circuit" was invented by ... Read More

US Patent Issued to QUALCOMM on Feb. 10 for "Apparatus and method for scheduling delayed ACKs/NACKs in LTE cellular systems" (American, Indian Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,148, issued on Feb. 10, was assigned to QUALCOMM Inc. (San Diego). "Apparatus and method for scheduling delayed ACKs/NACKs in LTE cellular ... Read More

US Patent Issued to SK hynix on Feb. 10 for "Test mode control circuit, semiconductor apparatus and system, and method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,820, issued on Feb. 10, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Test mode control circuit, semiconductor apparatus and s... Read More

US Patent Issued to Bayerische Motoren Werke on Feb. 10 for "Fold forming tool, fold forming device, method for producing a folded/bonded connection, and vehicle with folded/bonded connection" (German Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,822, issued on Feb. 10, was assigned to Bayerische Motoren Werke AG (Munich). "Fold forming tool, fold forming device, method for producing... Read More

US Patent Issued to HYUNDAI MOTOR, KIA, YURA, on Feb. 10 for "Grommet for vehicle and method of assembling grommet assembly for vehicle" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,200, issued on Feb. 10, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea), KIA Corp. (Seoul, South Korea) and YURA CORPORATION CO.,... Read More

US Patent Issued to Huizhou Fuyoushou E-Commerce on Feb. 10 for "Shoe box" (Chinese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. D1,111,455, issued on Feb. 10, was assigned to Huizhou Fuyoushou E-Commerce Co. Ltd. (Huizhou, China). "Shoe box" was invented by Shujian Yuan (Sh... Read More

US Patent Issued to ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE on Feb. 10 for "Apparatus and method for performing session management in mobile communication system" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,475, issued on Feb. 10, was assigned to ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (Daejeon, South Korea). "Apparatus and method... Read More

US Patent Issued to SEIKO EPSON on Feb. 10 for "Magnetic separation device and magnetic separation method" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,768, issued on Feb. 10, was assigned to SEIKO EPSON Corp. (Japan). "Magnetic separation device and magnetic separation method" was invented... Read More

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