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US Patent Issued to Tokyo Electron on July 1 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,645, issued on July 1, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was inv... Read More


US Patent Issued to GE-Hitachi Nuclear Energy Americas on July 1 for "Systems and methods for non-disruptive estimation and control of fluid flow rates" (North Carolina, New York Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,346,138, issued on July 1, was assigned to GE-Hitachi Nuclear Energy Americas LLC (Wilmington, N.C.). "Systems and methods for non-disruptive es... Read More


US Patent Issued to NGK INSULATORS on July 1 for "Pillar-shaped honeycomb structure" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,343,715, issued on July 1, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Pillar-shaped honeycomb structure" was invented by Shuji Murama... Read More


US Patent Issued to McLaren Automotive on July 1 for "Diaphragm forming" (British Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,343,948, issued on July 1, was assigned to McLaren Automotive Ltd. (Woking, Great Britain). "Diaphragm forming" was invented by Claudio Santoni ... Read More


US Patent Issued on July 1 for "Cutting insert for machine tools for metalworking" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. D1,081,744, issued on July 1. "Cutting insert for machine tools for metalworking" was invented by Sung Hun Kim (Cheongju-si, South Korea), Young He... Read More


US Patent Issued to Micron Technology on July 1 for "Semiconductor components having conductive vias with aligned back side conductors" (California, Idaho Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,731, issued on July 1, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor components having conductive vias with aligned ... Read More


US Patent Issued to NEOATOMIC on July 1 for "Overlay network for improved real-time packet flows" (Arizona, California Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,390, issued on July 1, was assigned to NEOATOMIC LLC (Las Vegas). "Overlay network for improved real-time packet flows" was invented by Jose... Read More


US Patent Issued to NANYA TECHNOLOGY on July 1 for "Method for preparing semiconductor device structure having features of different depths" (Taiwanese Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,680, issued on July 1, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Method for preparing semiconductor device structure hav... Read More


US Patent Issued to Zoom Communications on July 1 for "Ad hoc client audio device support for virtual conferences" (American, Chinese, Singaporean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,899, issued on July 1, was assigned to Zoom Communications Inc. (San Jose, Calif.). "Ad hoc client audio device support for virtual conferen... Read More


US Patent Issued to SCHLUMBERGER TECHNOLOGY on July 1 for "Devices, systems, and methods for downhole power generation" (British Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,345,134, issued on July 1, was assigned to SCHLUMBERGER TECHNOLOGY Corp. (Sugar Land, Texas). "Devices, systems, and methods for downhole power ... Read More