India, Oct. 25 -- The semiconductor industry is entering a transition phase that highlights the complementary roles of legacy and advanced packaging technologies. For decades, established methods such as wire bonding and single-die packaging have supported large-scale electronics manufacturing, powering consumer products, communication systems, and industrial applications. These techniques continue to be widely used due to their cost-efficiency, reliability, and scalability across diverse devices.

Simultaneously, as devices demand smaller footprints, greater data throughput, and improved energy efficiency, the adoption of advanced packaging technologies is accelerating. This shift does not suggest the obsolescence of legacy packaging. In...