ALEXANDRIA, Va., Dec. 31 -- United States Patent no. D1,107,384, issued on Dec. 30, was assigned to RELIVE Co. LTD. (Miyagi, Japan). "Pants" was invented by Masato Yoshida (Miyagi, Japan). The paten... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,126, issued on Dec. 30, was assigned to Innova Patent GmbH (Wolfurt, Austria). "Cableway having car stabilization" was invented by Gerd Dur... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. D1,107,557, issued on Dec. 30, was assigned to E. REMY MARTIN & Cdeg (Cognac, France). "Bottle" was invented by Guillaume Carre (Paris). The pate... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,086, issued on Dec. 30, was assigned to Jerome Canady Research Institute for Advanced Biological and Technological Sciences (Takoma Park, Md... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,799, issued on Dec. 30, was assigned to NANODOCKS TECHNOLOGY Ltd. (Hong Kong) and CITY UNIVERSITY OF HONG KONG (Hong Kong). "Electrospun fi... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,169, issued on Dec. 30, was assigned to Fameccanica.Data S.p.A. (San Giovanni Teatino Chieti, Italy). "Apparatus for treating continuous mo... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. D1,107,698, issued on Dec. 30, was assigned to Lenovo (Beijing) Ltd. (Beijing). "Computer mainframe" was invented by Shuai Guo (Beijing) and Zhe Y... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,414, issued on Dec. 30, was assigned to STEINEL GMBH (Herzebrock-Clarholz, Germany). "Optical element for a motion detector" was invented b... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,437, issued on Dec. 30, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Data transmission method, apparatus, and system" ... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,435, issued on Dec. 30, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor package having a solder wetting struc... Read More