ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,891, issued on Sept. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Glitch preventing input/outpu... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,430,274, issued on Sept. 30, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Processing core including integrated high capacity... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,920, issued on Sept. 30, was assigned to Halliburton Energy Services Inc. (Houston). "Downhole tool employing a pressure intensifier" was ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,430,856, issued on Sept. 30, was assigned to Lowe's Cos. Inc. (Mooresville, N.C.). "Compact augmented reality view experience" was invented by... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,948, issued on Sept. 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Compositional engineering of Schottky diode" was invented by ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,430,323, issued on Sept. 30, was assigned to Oracle International Corp. (Redwood Shores, Calif.). "Techniques for concurrent data value commit... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,805, issued on Sept. 30, was assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (Stockholm). "Method and apparatus for session management"... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,926, issued on Sept. 30, was assigned to Monolithic 3D Inc. (Allen, Texas). "Method to produce a 3D multilayer semiconductor device and st... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,385, issued on Sept. 30, was assigned to DENSO Corp. (Kariya, Japan). "Temperature sensor" was invented by Masaki Hironaka (Kariya, Japan)... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,293, issued on Sept. 30, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Multilayer ceramic electronic component, and metho... Read More