US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 23 for "Semiconductor device having underfill surrounding bottom package and solder ball" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,587, issued on Sept. 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device having u... Read More

US Patent Issued to ARAKAWA CHEMICAL INDUSTRIES on Sept. 23 for "Papermaking agent, manufacturing method for papermaking agent and paper" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,421,664, issued on Sept. 23, was assigned to ARAKAWA CHEMICAL INDUSTRIES LTD. (Osaka, Japan). "Papermaking agent, manufacturing method for pap... Read More

US Patent Issued to SEEKR TECHNOLOGIES on Sept. 23 for "Display screen or portion thereof with a graphical user interface with a civility score" (Virginia Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. D1,094,414, issued on Sept. 23, was assigned to SEEKR TECHNOLOGIES INC. (Vienna, Va.). "Display screen or portion thereof with a graphical user i... Read More

US Patent Issued to NOKIA TECHNOLOGIES on Sept. 23 for "Use of cell switch assistance information for SSB searching during satellite switching" (Danish, Polish Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,425,960, issued on Sept. 23, was assigned to NOKIA TECHNOLOGIES OY (Espoo, Finland). "Use of cell switch assistance information for SSB search... Read More

US Patent Issued to Google on Sept. 23 for "Hardware guided software prefetch insertion" (California, New York Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,423,101, issued on Sept. 23, was assigned to Google LLC (Mountain View, Calif.). "Hardware guided software prefetch insertion" was invented by... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Semiconductor package and thermal management method thereof" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,907, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and thermal manag... Read More

US Patent Issued to SAINT-GOBAIN ISOVER on Sept. 23 for "Device for modifying the temperature of a fibre-forming plate" (French Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,421,157, issued on Sept. 23, was assigned to SAINT-GOBAIN ISOVER (Courbevoie, France). "Device for modifying the temperature of a fibre-formin... Read More

US Patent Issued to Height Ventures on Sept. 23 for "Communication channel quality improvement system using machine conversions" (Utah Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,423,531, issued on Sept. 23, was assigned to Height Ventures LLC (Salt Lake City). "Communication channel quality improvement system using mac... Read More

US Patent Issued to Yiwu Ligao Technology on Sept. 23 for "Cushion backing" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. D1,093,914, issued on Sept. 23, was assigned to Yiwu Ligao Technology Co. Ltd. (Yiwu, China). "Cushion backing" was invented by Li Shi (Quzhou, C... Read More

US Patent Issued to Canon on Sept. 23 for "Information processing apparatus and method for candidate region merging" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,423,939, issued on Sept. 23, was assigned to Canon K.K. (Tokyo). "Information processing apparatus and method for candidate region merging" wa... Read More

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