ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,719, issued on May 20, was assigned to Amazon Technologies Inc. (Seattle). "Link down resilience" was invented by Roi Ben Haim (Netanya, Is... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. D1,075,570, issued on May 20, was assigned to Autonomous A2Z (Gyeongsan-si, South Korea). "Autonomous vehicle" was invented by Ji Hyeong Han (Anya... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,996, issued on May 20, was assigned to SAP SE (Walldorf, Germany). "Integrating data privacy integration protocols across system landscapes... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,888, issued on May 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Heated substrate support" was invented by Govinda Raj... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,994, issued on May 20, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan). "Vehicle platform, vehicle control interface box, and autonomou... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,307,227, issued on May 20. "Cloud instance selection based on automated performance metrics collection" was invented by Leonid Kuperman (Toront... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,302, issued on May 20, was assigned to Honda Motor Co. Ltd. (Tokyo). "Water electrolysis system" was invented by Takumi Kawano (Wako, Japan... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. D1,075,252, issued on May 20, was assigned to ASICS Corp. (Kobe, Japan). "Shoe sole" was invented by Kenta Tateno (Kobe, Japan), Hiroaki Nishimura... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,753, issued on May 20, was assigned to JAGUAR LAND ROVER Ltd. (Warwickshire, Great Britain). "Vehicle drivetrain modes" was invented by Dan... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,295, issued on May 20, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Method for obtaining parameters of semiconductor ... Read More