ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,727, issued on Dec. 16, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan) and Riken (Saitama, Japan). "Light-receiving e... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,496,880, issued on Dec. 16, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea). "Heat pump system fo... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,972, issued on Dec. 16, was assigned to Guangdong Shuowei Technology Co. Ltd. (Dongguan, China). "Support structure for protective housing ... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,496,076, issued on Dec. 16, was assigned to Penumbra Inc. (Alameda, Calif.). "Computer-aided vacuum thrombectomy systems and methods for proces... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,488, issued on Dec. 16, was assigned to Recursive Capital Inc. (Roseville, Calif.). "Intelligent asset evaluation systems using multi-modal... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,494, issued on Dec. 16, was assigned to Telefonaktiebolaget LM Ericsson (publ) (Stockholm). "Method and apparatus for random access" was in... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. D1,105,839, issued on Dec. 16, was assigned to ZHEJIANG YISITA INDUSTRIAL & TRADING Co. LTD. (Jinhua, China). "Lid" was invented by Lianjia Qian (... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,007, issued on Dec. 16, was assigned to GM GLOBAL TECHNOLOGY OPERATIONS LLC (Detroit). "Systems and methods for braking assistance for vehi... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,655, issued on Dec. 16, was assigned to GEN-PROBE Inc. (San Diego). "Compositions, methods and kits to detect adenovirus, metapneumovirus a... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,092, issued on Dec. 16, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan). "Chip package structure and method for fabr... Read More