Singapore, May 30 -- STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has appointed Singapore Power (SP Group) to upgrade its cooling infrastructure at the Toa Payoh site, which serves as a critical hub for ST's packaging R&D and wafer testing operations. This new system will improve energy efficiency and aims to reduce carbon emissions by approximately 2,140 tons annually.With a cooling capacity of up to 3,200 refrigerant tons (RT), the new cooling system's dual-temperature capability supplies both low and medium temperature cooling directly, eliminating the need for heat exchangers currently used to produce medium temperature cooling. It is designed to support all facilit...