SET CORPORATION SA secures contract for Microelectronic machinery and apparatus - Acquisition of a component assembly system using the flip-chip method (flip-chip bonder)

Posted On: 2025-12-22

France, Dec. 22 -- France based SET CORPORATION SA has secured contract from CNRS-Delegation Centre-Est for Microelectronic machinery and apparatus - Acquisition of a component assembly system using the flip-chip method (flip-chip bonder). The value of the contract is worth 39420000 EUR.

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SET CORPORATION SA secures contract for Microelectronic machinery and apparatus - Acquisition of a component assembly system using the flip-chip method (flip-chip bonder)