Pac Tech - Packaging Technologies GmbH secures contract for Checking and Testing Apparatus - Delivery of the Solder Jetting method for applying soldering balls

Poland, Aug. 12 -- Poland based Pac Tech - Packaging Technologies GmbH has secured contract from Centrum Zaawansowanych Materialow i Technologii CEZAMAT Politechniki Warszawskiej for Checking and Testing Apparatus - Delivery of the Solder Jetting method for applying soldering balls. The value of the contract is worth 29337700 PLN.

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