Japan, Sept. 10 -- Mitsubishi Electric Corporation announced that it has developed a new compact version of its DIPIPM power semiconductor modules specifically for use in consumer and industrial equipment such as packaged air conditioners and heat pump heating and hot water systems. The new Compact DIPIPM series of products comprises the PSS30SF1F6 (rated current 30A / rated voltage 600V) and the PSS50SF1F6 (rated current 50A / rated voltage 600V), and samples will begin shipping on September 22.By utilizing reverse-conducting insulated-gate bipolar transistors (RC-IGBTs),* the module's footprint has been reduced to almost 53% of that of the company's conventional Mini DIPIPM Ver.7 series of products, enabling more compact inverter substrat...