Taiwan, April 24 -- At the Shanghai International Automobile Industry Exhibition 2025 (Automobile Shanghai 2025), MediaTek announced its upcoming flagship Dimensity Auto Cockpit Platform C-X1 and Dimensity Auto Connect MT2739. MediaTek and its ecosystem partners showcased the future of intelligent driving experiences through generative AI-enhanced cockpit and agentic AI applications. These innovations integrate state-of-the-art AI and multimedia technologies into next-generation autonomous vehicles, delivering a comprehensive industry solution. Dimensity Auto Cockpit Platform C-X1The Dimensity Auto Cockpit Platform C-X1 SoC utilizes the most advanced 3nm manufacturing process available and is built on the latest Arm v9.2-A processor archite...