Jensys Corporation secures contract for Procurement of 0692-2540XM072923/01 Nantong Kangyuan Integrated Circuit Packaging Substrate Project (Phase I)-Needle Probe Testing Machine 1 set(2)

China, July 1 -- China based Jensys Corporation has secured contract from Nantong Hong Yuen Circuit Technology Co., Ltd. for Procurement of 0692-2540XM072923/01 Nantong Kangyuan Integrated Circuit Packaging Substrate Project (Phase I)-Needle Probe Testing Machine 1 set(2). The value of the contract is not disclosed.

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