United States, Jan. 13 -- Hyundai Mobis and Qualcomm Technologies, Inc. announced that the companies have signed a comprehensive agreement at CES 2026 to co-develop next generation solutions for Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems (ADAS). The MOU signing, held at the Hyundai Mobis booth, was attended by Jung Soo-Kyung, Executive Vice President and head of Automotive Electronics Business Unit, and Mr. Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT and Robotics, Qualcomm Technologies, Inc. Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leve...