HONGKONG JUHESIVE ELECTRONICS LIMITED secures contract for Procurement of 0722-254JT3523ZB6 High-Precision Flip Chip Bonder Project for the 49thResearch institute of China Electronics Technology Group Corporation(2)

China, Aug. 11 -- China based HONGKONG JUHESIVE ELECTRONICS LIMITED has secured contract from The 49th research institute of china electronics technology group corporation for Procurement of 0722-254JT3523ZB6 High-Precision Flip Chip Bonder Project for the 49thResearch institute of China Electronics Technology Group Corporation(2). The value of the contract is not disclosed.

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