Germany, July 28 -- For many electric and electronics (E&E) components, where stiffness and strength of polyamide 66 (PA66) reach their limit, BASF customers can now choose from a tailored portfolio of PA66/6T compounds: Ultramid(R) T6000 is a high-temperature polyamide outperforming PA66 in mechanical and dielectric properties in presence of humidity and at elevated temperatures. At the same time, its lower moisture absorption ensures good dimensional stability, thus closing the gap to BASF's Ultramid(R) Advanced (polyphthalamide: PPA) portfolio. Ultramid(R) T6000 allows for easy processing at low mold temperatures similar to standard PA66. Due to its good colorability, compounds with different white shades can be manufactured, in addition...