Singapore, Oct. 7 -- Dow will participate in Data Centre World 2025, from October 8th to 9th at Booth #112. Dow will spotlight the latest innovations in data center cooling solutions including thermal interface materials powered by DOWSIL (TM) silicones, direct-to-chip cooling - DOWFROST (TM) LC and immersion cooling fluids - DOWSIL (TM) ICL fluid.Dow's Total Data Centre Cooling SolutionsAs data centers grow in complexity and density, data centers' cooling and heat dissipation require next-level performance and energy efficiency. To cater to the current and future demands of data centers and AI ecosystems, Dow provides a range of data center cooling solutions to help our customers reduce energy usage and improve performance:DOWSIL (TM) Ther...