DISCO HI-TEC (CHINA) CO., LTD. secures contract for Procurement of 2890-254GK111AD35 ShanDong GRINM RS 12 inch Integrated Circuit Large Silicon Wafer Industrialization Project Phase II Procurement of Precision Grinding Equipment for Silicon Wafers(2)

China, Dec. 19 -- China based DISCO HI-TEC (CHINA) CO., LTD. has secured contract from ShanDong GRINM RS Semiconductor Materials Co., Ltd. for Procurement of 2890-254GK111AD35 ShanDong GRINM RS 12 inch Integrated Circuit Large Silicon Wafer Industrialization Project Phase II Procurement of Precision Grinding Equipment for Silicon Wafers(2). The value of the contract is not disclosed.

Published by HT Digital Content Services with permission from Pivotal Sources....