BEIJNG CAPCON LIMITED secures contract for Procurement of 0613-254022124124 Wafer Level Flip Chip Bonder Equipment(2)

China, Sept. 12 -- China based BEIJNG CAPCON LIMITED has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124124 Wafer Level Flip Chip Bonder Equipment(2). The value of the contract is not disclosed.

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