India, Feb. 20 -- The United States Department of State on Thursday announced a funding of as much as $200 million to companies or organisations working towards making secure, high-quality, and affordable handheld smartphone devices more accessible across the Indo-Pacific region.

The foreign assistance announced by the United States is called the 'Edge AI Package'.

The US Department of State said on Thursday that it is "proud to announce the launch of a competitive process to award up to $200 million in foreign assistance funding to support programmes to accelerate the deployment of secure, high-quality, and affordable handheld smartphone devices across the Indo-Pacific region."

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