India, May 27 -- Samsung may soon introduce the Galaxy Z Flip FE, possibly alongside the Galaxy Z Flip 7 and Galaxy Z Fold 7 during its upcoming Galaxy Unpacked event. Ahead of any official announcement, a new Geekbench listing has added to the ongoing speculation about the chipset powering the upcoming foldable phone.

The latest listing, under model number SM-F766U, shows the device running a ten-core chipset with a motherboard codenamed 's5e9955'. The processor includes one core at 3.30GHz, two at 2.75GHz, five at 2.36GHz, and two additional cores at 1.80GHz. This setup aligns with the Exynos 2500 chipset, marking a shift from previous listings that mentioned the Exynos 2400.

The Galaxy Z Flip FE unit tested on Geekbench reportedly ru...