India, Oct. 27 -- Micron Technology, a memory and storage solutions company, has announced customer sampling of its 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), the latest innovation designed to bring low-power, high-performance memory to the next generation of AI data centres.

The SOCAMM2 builds upon Micron's first-to-market LPDRAM SOCAMM, delivering 50% more capacity in the same compact footprint. Designed using Micron's 1-gamma DRAM process technology, the new module achieves over 20% power efficiency improvement and reduces time to first token (TTFT) by up to 80% in real-time inference workloads.

This advancement comes at a time when AI data centres are under increasing pressure to balance performance with susta...