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US Patent Issued to SAMSUNG ELECTRONICS on Oct. 14 for "Communication method and apparatus in wireless communication system supporting edge computing" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,445,992, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Communication method and apparatus in wirele... Read More


US Patent Issued to Tencent America on Oct. 14 for "Block vector refinement method for intra block copy" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,445,596, issued on Oct. 14, was assigned to Tencent America LLC (Palo Alto, Calif.). "Block vector refinement method for intra block copy" was ... Read More


US Patent Issued to Comcast Cable Communications on Oct. 14 for "Methods, systems, and apparatuses for improved data management" (Pennsylvania, Virginia Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,443,581, issued on Oct. 14, was assigned to Comcast Cable Communications LLC (Philadelphia). "Methods, systems, and apparatuses for improved da... Read More


US Patent Issued to STATS ChipPAC on Oct. 14 for "Semiconductor device and method of forming SiP module absent substrate" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,620, issued on Oct. 14, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of forming SiP module absent ... Read More


US Patent Issued to Sharp on Oct. 14 for "Heating cooking apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,121, issued on Oct. 14, was assigned to Sharp K.K. (Sakai, Japan). "Heating cooking apparatus" was invented by Masayuki Iwamoto (Sakai, Jap... Read More


US Patent Issued to Siemens on Oct. 14 for "Semiconductor component with damped bonding surfaces in a package with encapsulated pins" (German Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,671, issued on Oct. 14, was assigned to Siemens AG (Munich). "Semiconductor component with damped bonding surfaces in a package with encaps... Read More


US Patent Issued to Guangzhou Joyson Cleaning Products on Oct. 14 for "Oral care cleaning tablet" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,440,428, issued on Oct. 14, was assigned to Guangzhou Joyson Cleaning Products Co. Ltd. (Guangdong, China). "Oral care cleaning tablet" was inv... Read More


US Patent Issued to Novocure on Oct. 14 for "Methods of treating disease by skewing macrophage phenotype with alternating electric fields" (Israeli Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,440,680, issued on Oct. 14, was assigned to Novocure GmbH (Baar, Switzerland). "Methods of treating disease by skewing macrophage phenotype wit... Read More


US Patent Issued to GOOGLE on Oct. 14 for "Display screen or portion thereof with transitional graphical user interface" (Canadian, American, French Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. D1,098,140, issued on Oct. 14, was assigned to GOOGLE LLC (Mountain View, Calif.). "Display screen or portion thereof with transitional graphical ... Read More


US Patent Issued to Hoffmann-La Roche on Oct. 14 for "Methods of treating cancer by administering tumor necrosis factor (TNF) family ligand trimer-containing antigen-binding molecules" (Swiss, German Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,812, issued on Oct. 14, was assigned to Hoffmann-La Roche Inc. (Little Falls, N.J.). "Methods of treating cancer by administering tumor nec... Read More