ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,175, issued on July 1, was assigned to SIGNIFY HOLDING B.V. (Eindhoven, Netherlands). "System and methods to optimize neural networks using ... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,815, issued on July 1, was assigned to Roku Inc. (San Jose, Calif.). "Dynamic control of media-content presentation based on user presence a... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,346,291, issued on July 1, was assigned to VIMEO.COM INC. (New York). "On-the-fly/transparent fragmented ISOBMFF to progressive ISOBMFF transmul... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,712, issued on July 1, was assigned to Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V. (Munich). "Extended reference in... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,786, issued on July 1, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device including a panel alignment mark" ... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,345,049, issued on July 1, was assigned to Englert Inc. (East Brunswick, N.J.). "Downspout with debris trap" was invented by Edward Sutton (East... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,343,142, issued on July 1, was assigned to Masimo Corp. (Irvine, Calif.). "System for displaying and controlling medical monitoring data" was in... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,107, issued on July 1, was assigned to ZTE Corp. (Shenzhen, China). "Methods, apparatus and systems for scheduling and transmission of syste... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,628, issued on July 1, was assigned to Tencent Technology (Shenzhen) Co. Ltd. (Shenzhen, China). "Data processing method, apparatus, compute... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,749, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor packages" was invented ... Read More