ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,480, issued on Nov. 18. "Combined audio and video apparatus" was invented by Jianyong Zeng (Guangdong, China) and Qihao Fang (Guangdong, Ch... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,225, issued on Nov. 18, was assigned to TDK Corp. (Tokyo). "Stacked electrode, electrode-equipped strain resistance film, and pressure sens... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,464, issued on Nov. 18, was assigned to PRIME PLANET ENERGY & SOLUTIONS INC. (Tokyo). "Electric power adjusting device" was invented by Kim... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,498, issued on Nov. 18, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan) and Sumitomo Electric Hardmetal Corp. (Itami, Japan... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,413, issued on Nov. 18, was assigned to QUALCOMM Inc. (San Diego). "Techniques for communicating mobility information" was invented by Huic... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,468, issued on Nov. 18, was assigned to Ava Labs Inc. (New York). "Administrative precompiles" was invented by Aaron Buchwald (New York). ... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,760, issued on Nov. 18, was assigned to RICOH COMPANY LTD. (Tokyo). "Head-maintenance device and liquid discharge apparatus" was invented b... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,154, issued on Nov. 18, was assigned to OREXO AB (Uppsala, Sweden). "Pharmaceutical composition comprising adrenaline" was invented by Jona... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,444, issued on Nov. 18, was assigned to SHENZHEN THOUSANDSHORES TECHNOLOGY Co. LTD. (Shenzhen, China). "Marker inks and methods for prepari... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,223, issued on Nov. 18, was assigned to Taiwan Semiconducotr Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method of... Read More