ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,767, issued on Nov. 18, was assigned to JULIUS BLUM GMBH (Hoechst, Austria). "Damper" was invented by Thomas Schuler (Hard, Austria), Simon... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,839, issued on Nov. 18, was assigned to Lumentum Operations (San Jose, Calif.). "Semiconductor photodetector" was invented by Takashi Toyon... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,369, issued on Nov. 18, was assigned to Koki Holdings Co. Ltd. (Tokyo). "Battery" was invented by Shingo Kosugi (Ibaraki, Japan) and Rui Ak... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,010, issued on Nov. 18, was assigned to NINEPATCH INC. (Dover, Del.). "Ninepatch oneview" was invented by Richard Arzt Thompson (Grand Junc... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,305, issued on Nov. 18, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Communication method and apparatus" was invented b... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,662, issued on Nov. 18, was assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY LP (Spring, Texas). "Photoconductive drum supports" was invente... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,531, issued on Nov. 18, was assigned to Clearfield Inc. (Minneapolis). "Adapter dustcap with built-in cleaner" was invented by Cheryl Johns... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,400, issued on Nov. 18, was assigned to CELONA INC. (Campbell, Calif.). "Method and apparatus for using microslices to control network perf... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,772, issued on Nov. 18, was assigned to DORMAKABA DEUTSCHLAND GMBH (Ennepetal, Germany). "Method for operating a door actuator" was invente... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,183, issued on Nov. 18, was assigned to Intel Corp. (Santa Clara, Calif.). "Punch-through interconnect feature to couple upper electrodes o... Read More