US Patent Issued to Applied Materials on Aug. 5 for "Package imaging for die location correction in digital lithography" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,379,676, issued on Aug. 5, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Package imaging for die location correction in digital... Read More

US Patent Issued to ARTERY TECHNOLOGY on Aug. 5 for "Controller for controlling electric motor module equipped with incremental encoder and operation method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,379,704, issued on Aug. 5, was assigned to ARTERY TECHNOLOGY COMPANY (Hsinchu, Taiwan). "Controller for controlling electric motor module equipp... Read More

US Patent Issued on Aug. 5 for "Garage door seal" (Australian Inventor)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. D1,087,392, issued on Aug. 5. "Garage door seal" was invented by Bruce Andrew Pirie Kuschert (Vineyard, Australia). The patent was filed on Dec. 1... Read More

US Patent Issued to Hexagon Purus North America Holdings on Aug. 5 for "Electric front end accessory devices assembly" (Canadian Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,274, issued on Aug. 5, was assigned to Hexagon Purus North America Holdings Inc. (Lincoln, Neb.). "Electric front end accessory devices asse... Read More

US Patent Issued to LEICA MICROSYSTEMS CMS on Aug. 5 for "Microscope" (Chinese, German Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. D1,087,196, issued on Aug. 5, was assigned to LEICA MICROSYSTEMS CMS GMBH (Wetzlar, Germany). "Microscope" was invented by Fei Wang (Jiangsu, China... Read More

US Patent Issued to Honor Device on Aug. 5 for "Adjustment method and apparatus for driving waveform, electronic device, and readable storage medium" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,380,775, issued on Aug. 5, was assigned to Honor Device Co. Ltd. (Shenzhen, China). "Adjustment method and apparatus for driving waveform, elect... Read More

US Patent Issued to IMEC VZW on Aug. 5 for "Method of manufacturing an interconnection structure for a semiconductor device having a spacer separating first and second conductive lines" (Belgian Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,116, issued on Aug. 5, was assigned to IMEC VZW (Leuven, Belgium). "Method of manufacturing an interconnection structure for a semiconductor... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Aug. 5 for "Semiconductor structure and method for manufacturing same" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,696, issued on Aug. 5, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Semiconductor structure and method for manufacturi... Read More

US Patent Issued to Max on Aug. 5 for "Stapler" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,377,572, issued on Aug. 5, was assigned to Max Co. Ltd. (Tokyo). "Stapler" was invented by Takushi Shindo (Tokyo) and Futoshi Kameda (Tokyo). A... Read More

US Patent Issued to QUALCOMM on Aug. 5 for "Spatial division multiplexing for reduced capability wireless devices" (American, Chinese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,474, issued on Aug. 5, was assigned to QUALCOMM Inc. (San Diego). "Spatial division multiplexing for reduced capability wireless devices" wa... Read More

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