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US Patent Issued to Intel on Jan. 27 for "Systems, apparatus, articles of manufacture, and methods for distributed and scalable high performance location and positioning" (Oregon, Arizona Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,551, issued on Jan. 27, was assigned to Intel Corp. (Santa Clara, Calif.). "Systems, apparatus, articles of manufacture, and methods for di... Read More


US Patent Issued to SEOUL VIOSYS on Jan. 27 for "LED chip having fan-out structure and manufacturing method of the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,624, issued on Jan. 27, was assigned to SEOUL VIOSYS Co. LTD. (Ansan-si, South Korea). "LED chip having fan-out structure and manufacturing... Read More


US Patent Issued to SOUTHWEST PETROLEUM UNIVERSITY on Jan. 27 for "Methods and systems for accurate well-seismic tie based on stepwise matching and optimization" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,609, issued on Jan. 27, was assigned to SOUTHWEST PETROLEUM UNIVERSITY (Chengdu, China). "Methods and systems for accurate well-seismic tie... Read More


US Patent Issued to SIKA TECHNOLOGY on Jan. 27 for "Multi-orifice nozzle" (Swiss Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,705, issued on Jan. 27, was assigned to SIKA TECHNOLOGY AG (Baar, Switzerland). "Multi-orifice nozzle" was invented by Bernhard Reingardt (... Read More


US Patent Issued to Saviz Sepah on Jan. 27 for "Methods and compositions for testosterone production" (California Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,363, issued on Jan. 27, was assigned to Saviz Sepah (Santa Monica, Calif.). "Methods and compositions for testosterone production" was inve... Read More


US Patent Issued to KOREA ELECTRONICS TECHNOLOGY INSTITUTE on Jan. 27 for "Method and apparatus for adjusting adaptive patch packing block size" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,977, issued on Jan. 27, was assigned to KOREA ELECTRONICS TECHNOLOGY INSTITUTE (Seongnam-si, South Korea). "Method and apparatus for adjust... Read More


US Patent Issued to NEC on Jan. 27 for "Imaging system, imaging method, and non-transitory computer-readable medium" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,020, issued on Jan. 27, was assigned to NEC Corp. (Tokyo). "Imaging system, imaging method, and non-transitory computer-readable medium" wa... Read More


US Patent Issued to Hua Hsu Advanced Technology on Jan. 27 for "Method for wafer treatment" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,764, issued on Jan. 27, was assigned to Hua Hsu Advanced Technology Co. Ltd. (Taichung, Taiwan). "Method for wafer treatment" was invented ... Read More


US Patent Issued to CANON on Jan. 27 for "Electronic device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,464, issued on Jan. 27, was assigned to CANON K.K. (Tokyo). "Electronic device" was invented by Koichi Odagaki (Kanagawa, Japan). Accordin... Read More


US Patent Issued to Oracle International on Jan. 27 for "Bare metal with converged network interface controller (NIC) with automated image qualification service within infrastructure as service (IaaS) environment" (Washington Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,640, issued on Jan. 27, was assigned to Oracle International Corp. (Redwood Shores, Calif.). "Bare metal with converged network interface c... Read More