Japan, Feb. 6 -- GEOTECHNOLOGIES INC has got intellectual property rights for 'NOTIFICATION SYSTEM, INFORMATION PROCESSING APPARATUS, NOTIFICATION TRANSMISSION METHOD, AND NOTIFICATION TRANSMISSION PR... Read More
Japan, Feb. 6 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER GENERATION APPARATUS.' Other related details are as follows: Application Number: JP,2022-013216 Category (FI)... Read More
Japan, Feb. 6 -- SEKISUI CHEM CO LTD has got intellectual property rights for 'POWER SUPPLY SYSTEM AND BUILDING.' Other related details are as follows: Application Number: JP,2022-012697 Category (F... Read More
Japan, Feb. 6 -- SATO HOLDINGS CORP has got intellectual property rights for 'PRINTER AND CUTTER UNIT OF THE SAME.' Other related details are as follows: Application Number: JP,2022-011890 Category ... Read More
Japan, Feb. 6 -- ALINCO INC has got intellectual property rights for 'WORK TABLE.' Other related details are as follows: Application Number: JP,2022-011547 Category (FI): B60B33/06@B,B60B33/00@W St... Read More
Japan, Feb. 6 -- GAIANIXX INC has got intellectual property rights for 'CRISTAL FILM, LAMINATE STRUCTURE, ELECTRONIC DEVICE, ELECTRONIC UNIT AND MANUFACTURING METHODS THEREOF.' Other related details a... Read More
Japan, Feb. 6 -- GAIANIXX INC has got intellectual property rights for 'CRISTAL FILM, LAMINATE STRUCTURE, ELECTRONIC DEVICE, ELECTRONIC UNIT AND MANUFACTURING METHODS THEREOF.' Other related details a... Read More
Japan, Feb. 6 -- MITSUBISHI ELECTRIC INFORMATION NETWORK CORP has got intellectual property rights for 'PARAMETER CORRECTION APPARATUS, PARAMETER CORRECTION METHOD, AND PARAMETER CORRECTION PROGRAM.' ... Read More
Japan, Feb. 6 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN SEALING DEVICE AND RESIN SEALING METHOD.' Other related details are as follows: Application Number: JP,2022-011200 C... Read More
Japan, Feb. 6 -- SEKISUI CHEM CO LTD has got intellectual property rights for 'MULLION, MANUFACTURING METHOD OF MULLION, AND GLASS WALL.' Other related details are as follows: Application Number: JP,... Read More