Japan, Feb. 6 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER GENERATION APPARATUS.' Other related details are as follows:
Application Number: JP,2022-013216
Category (FI): B28D5/04@B,H10P54/20,101,B23K26/53,B28D7/04,H01L21/304,611@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 31, 2022
Publication Date: Aug. 10, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....