MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202441016307 A) filed by Hindustan Petroleum Corporation Limited, Bengaluru, Karnataka, on March 7, 2024, for... Read More
MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079626 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on Aug. 22, for 'electron... Read More
MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411013498 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Moha... Read More
MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202441016306 A) filed by Hindustan Petroleum Corporation Limited, Bengaluru, Karnataka, on March 7, 2024, for... Read More
MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079261 A) filed by Evoloh, Inc., Palo Alto, U.S.A., on Aug. 21, for 'scalable flow field for an electro... Read More
MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012847 A) filed by Bennett University, Greater Noida, Uttar Pradesh, on Feb. 22, 2024, for 'ai-enhanced... Read More
MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079253 A) filed by Lg Energy Solution, Ltd., Seoul, Republic of Korea, on Aug. 21, for 'negative electr... Read More
MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012846 A) filed by Bennett University, Greater Noida, Uttar Pradesh, on Feb. 22, 2024, for 'contactless... Read More
MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012845 A) filed by Bennett University, Greater Noida, Uttar Pradesh, on Feb. 22, 2024, for 'machine lea... Read More
MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079243 A) filed by Techno-Umg Co. Ltd., Tokyo, on Aug. 21, for 'thermoplastic resin composition and mol... Read More