US Patent Issued to Amazon Technologies on Nov. 4 for "Rapid GPU scrubbing in a cloud provider network using same-slot auxiliary domains" (South African Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,836, issued on Nov. 4, was assigned to Amazon Technologies Inc. (Seattle). "Rapid GPU scrubbing in a cloud provider network using same-slot ... Read More

US Patent Issued to DALIAN UNIVERSITY OF TECHNOLOGY on Nov. 4 for "Cross-shaped high-temperature three-dimensional hall sensor and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,174, issued on Nov. 4, was assigned to DALIAN UNIVERSITY OF TECHNOLOGY (Dalian, China). "Cross-shaped high-temperature three-dimensional hal... Read More

US Patent Issued to The Boeing on Nov. 4 for "Development of a product using a process control plan digital twin" (American, Indian Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,511, issued on Nov. 4, was assigned to The Boeing Co. (Arlington, Va.). "Development of a product using a process control plan digital twin"... Read More

US Patent Issued to HUAWEI CLOUD COMPUTING TECHNOLOGIES on Nov. 4 for "Online migration method and system for bare metal server" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,766, issued on Nov. 4, was assigned to HUAWEI CLOUD COMPUTING TECHNOLOGIES Co. LTD. (Guizhou, China). "Online migration method and system fo... Read More

US Patent Issued to STATS ChipPAC on Nov. 4 for "Power envelope analysis for the thermal optimization of multi-chip modules" (South Korean, American, Chinese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,462,084, issued on Nov. 4, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Power envelope analysis for the thermal optimization of multi-c... Read More

US Patent Issued to Micron Technology on Nov. 4 for "Conductive interconnects and methods of forming conductive interconnects" (Idaho Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,129, issued on Nov. 4, was assigned to Micron Technology Inc. (Boise, Idaho). "Conductive interconnects and methods of forming conductive in... Read More

US Patent Issued to MYOKARDIA on Nov. 4 for "Polymorphic forms of (R)-4-(1-((3-(difluoromethyl)-1-methyl-1H-pyrazol-4-yl)sulfonyl)-1- fluoroethyl)-N-(isoxazol-3-yl)piperidine-1-carboxamide" (French, American Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,919, issued on Nov. 4, was assigned to MYOKARDIA INC. (Brisbane, Calif.). "Polymorphic forms of (R)-4-(1-((3-(difluoromethyl)-1-methyl-1H-py... Read More

Noida police save seven cybercrime victims who lost rRs.r2 crore in fraud across India

India, Nov. 6 -- In a major intervention, Noida Police has saved seven cybercrime victims across India who had fallen prey to a cyber fraud, and transferred around Rs.2 crore until the police informed... Read More

Fake CID officer who robbed 25 men nabbed in Athurugiriya

Sri Lanka, Nov. 6 -- A former police officer who had posed as a senior CID officer and allegedly robbed more than 25 young men of their cash and valuables, along with two accomplices, was arrested yes... Read More

Aswesuma beneficiaries should feel ashamed: Handunnetti

Sri Lanka, Nov. 6 -- Industries and Entrepreneurship Development Minister Sunil Handunnetti yesterday said that those accepting Aswesuma benefits should be ashamed, describing it as "legal begging." ... Read More

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