ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,132, issued on Dec. 23, was assigned to NICHIA Corp. (Anan, Japan). "Light-emitting device, lighting appliance, and street light" was inven... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,683, issued on Dec. 23, was assigned to Anemorix LLC (Rancho Cordova, Calif.). "Porous glucomannan scaffolds and methods for producing the ... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,235, issued on Dec. 23, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Battery module" was invented by Bum Choi (Daejeon, S... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,870, issued on Dec. 23, was assigned to InterDigital VC Holdings Inc. (Wilmington, Del.). "Scalar quantizer decision scheme for dependent s... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,007, issued on Dec. 23, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Device and method for c... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,716, issued on Dec. 23, was assigned to CJ CHEILJEDANG Corp. (Seoul, South Korea). "Promoter and method of producing glutathione using the ... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,532, issued on Dec. 23, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Display device, display panel and method of manufacturing... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,659, issued on Dec. 23, was assigned to INSPUR SUZHOU INTELLIGENT TECHNOLOGY Co. LTD. (Jiangsu, China). "Bare metal detection method and sy... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,361, issued on Dec. 23, was assigned to Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences (Beijing). "Intelligent... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. D1,106,985, issued on Dec. 23, was assigned to MXW Device (Shenzhen) Co. Ltd. (Shenzhen, China). "Multilayer integrated circuit carrier board" was... Read More