US Patent Issued to MXW Device (Shenzhen) on Dec. 23 for "Multilayer integrated circuit carrier board" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. D1,106,985, issued on Dec. 23, was assigned to MXW Device (Shenzhen) Co. Ltd. (Shenzhen, China).

"Multilayer integrated circuit carrier board" was invented by Steve Yuen (Guangdong, China) and Du Chen (Guangdong, China).

The patent was filed on May 12, 2023, under Application No. D/892,078.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1106985&OS=D1106985&RS=D1106985

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