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US Patent Issued to MURATA MANUFACTURING on Dec. 23 for "Block coil" (British Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,505,951, issued on Dec. 23, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Block coil" was invented by Takayuki Tange (Milton K... Read More


US Patent Issued to Lenovo (Singapore) on Dec. 23 for "Electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,782, issued on Dec. 23, was assigned to Lenovo (Singapore) Pte. Ltd. (Singapore). "Electronic apparatus" was invented by Atsushi Ohyama (Ka... Read More


US Patent Issued to RTX on Dec. 23 for "Ceramic matrix composite component with coating" (Connecticut, Texas Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,953, issued on Dec. 23, was assigned to RTX Corp. (Farmington, Conn.). "Ceramic matrix composite component with coating" was invented by Ju... Read More


US Patent Issued to QUALCOMM on Dec. 23 for "Paging multiple devices using a common paging occasion" (Chinese, American Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,206, issued on Dec. 23, was assigned to QUALCOMM Inc. (San Diego). "Paging multiple devices using a common paging occasion" was invented by... Read More


US Patent Issued to The University of Chicago on Dec. 23 for "Wearable microphone jammer" (Illinois Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,556, issued on Dec. 23, was assigned to The University of Chicago (Chicago). "Wearable microphone jammer" was invented by Haitao Zheng (Chi... Read More


US Patent Issued to MURATA MANUFACTURING on Dec. 23 for "Tunable hybrid wideband LNA architecture" (California Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,447, issued on Dec. 23, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Tunable hybrid wideband LNA architecture" was i... Read More


US Patent Issued to SEMES on Dec. 23 for "Method of bonding a semiconductor die to a wafer" (South Korean Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,113, issued on Dec. 23, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea). "Method of bonding a semiconductor die to a wafer"... Read More


US Patent Issued to Columbia Sportswear North America on Dec. 23 for "Multilayered multifunctional heat-management material" (Oregon, Georgia Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,501,954, issued on Dec. 23, was assigned to Columbia Sportswear North America Inc. (Portland, Ore.). "Multilayered multifunctional heat-managem... Read More


US Patent Issued to Mitsubishi Electric on Dec. 23 for "Redundant resolver and electric power steering device mounted therewith" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,154, issued on Dec. 23, was assigned to Mitsubishi Electric Corp. (Tokyo). "Redundant resolver and electric power steering device mounted t... Read More


US Patent Issued to Nanyang Technological University on Dec. 23 for "Therapeutic hydrogel device" (Singaporean Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,502,460, issued on Dec. 23, was assigned to Nanyang Technological University (Singapore). "Therapeutic hydrogel device" was invented by Thuy Tr... Read More