ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,113, issued on Dec. 23, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea).
"Method of bonding a semiconductor die to a wafer" was invented by Hang Lim Lee (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The inventive concept provides a bonding method. The bonding method includes bonding a second bonding object to a first bonding object, which is a bonding step; providing a protective agent to a region of the first bonding object which is not bonded to the second bonding object, which is a protective agent providing step; and etching a backside of the second bonding object, which is an etching step."
The patent ...