US Patent Issued to Sony Semiconductor Solutions on Nov. 18 for "Light-emitting element array" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,433, issued on Nov. 18, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Light-emitting element array" was invented b... Read More

US Patent Issued to OMRON on Nov. 18 for "Control device, robot, control method, and program" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,635, issued on Nov. 18, was assigned to OMRON Corp. (Kyoto, Japan). "Control device, robot, control method, and program" was invented by No... Read More

US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Nov. 18 for "Wireless communication system, repeater, and wireless communication method" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,509, issued on Nov. 18, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan). "Wireless communication system,... Read More

US Patent Issued to GUANGZHOU TECH-LONG PACKAGING MACHINERY on Nov. 18 for "Heat treatment device for pet bottle preform with integral handle" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,676, issued on Nov. 18, was assigned to GUANGZHOU TECH-LONG PACKAGING MACHINERY Co. LTD (Guangdong, China). "Heat treatment device for pet ... Read More

US Patent Issued to MURATA MANUFACTURING on Nov. 18 for "Semiconductor structure enhanced for high voltage applications" (French Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,758, issued on Nov. 18, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Semiconductor structure enhanced for high volta... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 18 for "Semiconductor package and method of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,213, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method of... Read More

US Patent Issued to GDM on Nov. 18 for "Apparatus and method for mutually welding at least two elements of an absorbent sanitary item" (Italian Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,106, issued on Nov. 18, was assigned to GDM S.p.A. (Bologna, Italy). "Apparatus and method for mutually welding at least two elements of an... Read More

US Patent Issued to Dow Global Technologies, Dow Silicones on Nov. 18 for "Composition and method for silyl hydride reaction catalyzed by fluorinated arylborane Lewis acids" (Michigan, Texas, Pennsylvania Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,404, issued on Nov. 18, was assigned to Dow Global Technologies LLC (Midland, Mich.) and Dow Silicones Corp. (Midland, Mich.). "Composition... Read More

US Patent Issued to Nokia Technologies on Nov. 18 for "Network slice local switching at a distributed unit" (British Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,316, issued on Nov. 18, was assigned to Nokia Technologies Oy (Espoo, Finland). "Network slice local switching at a distributed unit" was i... Read More

US Patent Issued to MICROBIOPHARM JAPAN on Nov. 18 for "Method for enzymatically producing maytansinol" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,579, issued on Nov. 18, was assigned to MICROBIOPHARM JAPAN Co. LTD. (Tokyo). "Method for enzymatically producing maytansinol" was invented... Read More

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